Semiconductor device and method of forming shielding layer over active surface of semiconductor die

ABSTRACT

A semiconductor wafer contains a plurality of semiconductor die separated by a non-active area of the semiconductor wafer. A plurality of contact pads is formed on an active surface of the semiconductor die. A first insulating layer is formed over the semiconductor wafer. A portion of the first insulating layer is removed to expose the contact pads on the semiconductor die. An opening is formed partially through the semiconductor wafer in the active surface of the semiconductor die or in the non-active area of the semiconductor wafer. A second insulating layer is formed in the opening in the semiconductor wafer. A shielding layer is formed over the active surface. The shielding layer extends into the opening of the semiconductor wafer to form a conductive via. A portion of a back surface of the semiconductor wafer is removed to singulate the semiconductor die.

FIELD OF THE INVENTION

The present invention relates in general to semiconductor devices and,more particularly, to a semiconductor device and method of forming anEMI and RFI shielding layer over an active surface and side surfaces ofa semiconductor die.

BACKGROUND OF THE INVENTION

Semiconductor devices are commonly found in modern electronic products.Semiconductor devices vary in the number and density of electricalcomponents. Discrete semiconductor devices generally contain one type ofelectrical component, e.g., light emitting diode (LED), small signaltransistor, resistor, capacitor, inductor, and power metal oxidesemiconductor field effect transistor (MOSFET). Integrated semiconductordevices typically contain hundreds to millions of electrical components.Examples of integrated semiconductor devices include microcontrollers,microprocessors, charged-coupled devices (CCDs), solar cells, anddigital micro-mirror devices (DMDs).

Semiconductor devices perform a wide range of functions such as signalprocessing, high-speed calculations, transmitting and receivingelectromagnetic signals, controlling electronic devices, transformingsunlight to electricity, and creating visual projections for televisiondisplays. Semiconductor devices are found in the fields ofentertainment, communications, power conversion, networks, computers,and consumer products. Semiconductor devices are also found in militaryapplications, aviation, automotive, industrial controllers, and officeequipment.

Semiconductor devices exploit the electrical properties of semiconductormaterials. The atomic structure of semiconductor material allows itselectrical conductivity to be manipulated by the application of anelectric field or base current or through the process of doping. Dopingintroduces impurities into the semiconductor material to manipulate andcontrol the conductivity of the semiconductor device.

A semiconductor device contains active and passive electricalstructures. Active structures, including bipolar and field effecttransistors, control the flow of electrical current. By varying levelsof doping and application of an electric field or base current, thetransistor either promotes or restricts the flow of electrical current.Passive structures, including resistors, capacitors, and inductors,create a relationship between voltage and current necessary to perform avariety of electrical functions. The passive and active structures areelectrically connected to form circuits, which enable the semiconductordevice to perform high-speed calculations and other useful functions.

Semiconductor devices are generally manufactured using two complexmanufacturing processes, i.e., front-end manufacturing, and back-endmanufacturing, each involving potentially hundreds of steps. Front-endmanufacturing involves the formation of a plurality of die on thesurface of a semiconductor wafer. Each die is typically identical andcontains circuits formed by electrically connecting active and passivecomponents. The term “semiconductor die” as used herein refers to boththe singular and plural form of the word, and accordingly can refer toboth a single semiconductor device and multiple semiconductor devices.Back-end manufacturing involves singulating individual die from thefinished wafer and packaging the die to provide structural support andenvironmental isolation.

One goal of semiconductor manufacturing is to produce smallersemiconductor devices. Smaller devices typically consume less power,have higher performance, and can be produced more efficiently. Inaddition, smaller semiconductor devices have a smaller footprint, whichis desirable for smaller end products. A smaller die size can beachieved by improvements in the front-end process resulting in die withsmaller, higher density active and passive components. Back-endprocesses may result in semiconductor device packages with a smallerfootprint by improvements in electrical interconnection and packagingmaterials.

Another goal of semiconductor manufacturing is to produce higherperformance semiconductor devices. Increases in device performance canbe accomplished by forming active components that are capable ofoperating at higher speeds. In high frequency applications, such asradio frequency (RF) wireless communications, integrated passive devices(IPDs) are often contained within the semiconductor device. Examples ofIPDs include resistors, capacitors, and inductors. A typical RF systemrequires multiple IPDs in one or more semiconductor packages to performthe necessary electrical functions. However, high frequency electricaldevices generate or are susceptible to undesired electromagneticinterference (EMI) and radio frequency interference (RFI), or otherinter-device interference, such as capacitive, inductive, or conductivecoupling, also known as cross-talk, which can interfere with deviceoperation.

Semiconductor devices commonly use a metal shielding layer mounted to anencapsulant formed over the semiconductor die to reduce EMI and RFI. Theshield layer is typically electrically connected through a build-upinterconnect structure to a low impedance ground point to dissipate theEMI and RFI energy.

SUMMARY OF THE INVENTION

A need exists to isolate semiconductor die from EMI, RFI, and otherinter-device interference. Accordingly, in one embodiment, the presentinvention is a method of making a semiconductor device comprising thesteps of providing a semiconductor wafer containing a plurality ofsemiconductor die separated by a non-active area of the semiconductorwafer, forming a plurality of contact pads on an active surface of thesemiconductor die, forming a first insulating layer over thesemiconductor wafer, removing a portion of the first insulating layer toexpose the contact pads on the semiconductor die, forming an openingpartially through the semiconductor wafer in the active surface of thesemiconductor die or in the non-active area of the semiconductor wafer,forming a second insulating layer in the opening in the semiconductorwafer, forming a shielding layer over the active surface with theshielding layer extending into the opening of the semiconductor wafer toform a conductive via, and removing a portion of a back surface of thesemiconductor wafer to singulate the semiconductor die.

In another embodiment, the present invention is a method of making asemiconductor device comprising the steps of providing a semiconductorwafer containing a plurality of semiconductor die, forming a firstinsulating layer over the semiconductor wafer, forming an openingpartially through the semiconductor wafer, forming a second insulatinglayer in the opening in the semiconductor wafer, forming a shieldinglayer over an active surface of the semiconductor die with the shieldinglayer extending into the opening of the semiconductor wafer to form aconductive via, and removing a portion of a back surface of thesemiconductor wafer to singulate the semiconductor die.

In another embodiment, the present invention is a method of making asemiconductor device comprising the steps of providing a semiconductordie, forming a first insulating layer over the semiconductor die,forming an opening through the semiconductor die, and forming ashielding layer over an active surface of the semiconductor die with theshielding layer extending into the opening of the semiconductor die toform a conductive via.

In another embodiment, the present invention is a semiconductor devicecomprising a semiconductor wafer containing a plurality of semiconductordie. A first insulating layer is formed over the semiconductor wafer. Anopening is formed through the semiconductor wafer. A second insulatinglayer is formed in the opening in the semiconductor wafer. A shieldinglayer is formed over an active surface of the semiconductor die. Theshielding layer extends into the opening of the semiconductor wafer toform a conductive via.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a PCB with different types of packages mounted to itssurface;

FIGS. 2 a-2 c illustrate further detail of the representativesemiconductor packages mounted to the PCB;

FIGS. 3 a-3 h illustrate a process of forming an EMI and RFI shieldinglayer over an active surface and side surfaces of a semiconductor die;

FIGS. 4 a-4 b illustrate the shielding layer formed over the activesurface and side surfaces of the semiconductor die; and

FIG. 5 illustrates the semiconductor die with shielding layer mounted toa substrate.

DETAILED DESCRIPTION OF THE DRAWINGS

The present invention is described in one or more embodiments in thefollowing description with reference to the figures, in which likenumerals represent the same or similar elements. While the invention isdescribed in terms of the best mode for achieving the invention'sobjectives, it will be appreciated by those skilled in the art that itis intended to cover alternatives, modifications, and equivalents as maybe included within the spirit and scope of the invention as defined bythe appended claims and their equivalents as supported by the followingdisclosure and drawings.

Semiconductor devices are generally manufactured using two complexmanufacturing processes: front-end manufacturing and back-endmanufacturing. Front-end manufacturing involves the formation of aplurality of die on the surface of a semiconductor wafer. Each die onthe wafer contains active and passive electrical components, which areelectrically connected to form functional electrical circuits. Activeelectrical components, such as transistors and diodes, have the abilityto control the flow of electrical current. Passive electricalcomponents, such as capacitors, inductors, resistors, and transformers,create a relationship between voltage and current necessary to performelectrical circuit functions.

Passive and active components are formed over the surface of thesemiconductor wafer by a series of process steps including doping,deposition, photolithography, etching, and planarization. Dopingintroduces impurities into the semiconductor material by techniques suchas ion implantation or thermal diffusion. The doping process modifiesthe electrical conductivity of semiconductor material in active devices,transforming the semiconductor material into an insulator, conductor, ordynamically changing the semiconductor material conductivity in responseto an electric field or base current. Transistors contain regions ofvarying types and degrees of doping arranged as necessary to enable thetransistor to promote or restrict the flow of electrical current uponthe application of the electric field or base current.

Active and passive components are formed by layers of materials withdifferent electrical properties. The layers can be formed by a varietyof deposition techniques determined in part by the type of materialbeing deposited. For example, thin film deposition can involve chemicalvapor deposition (CVD), physical vapor deposition (PVD), electrolyticplating, and electroless plating processes. Each layer is generallypatterned to form portions of active components, passive components, orelectrical connections between components.

The layers can be patterned using photolithography, which involves thedeposition of light sensitive material, e.g., photoresist, over thelayer to be patterned. A pattern is transferred from a photomask to thephotoresist using light. In one embodiment, the portion of thephotoresist pattern subjected to light is removed using a solvent,exposing portions of the underlying layer to be patterned. In anotherembodiment, the portion of the photoresist pattern not subjected tolight, the negative photoresist, is removed using a solvent, exposingportions of the underlying layer to be patterned. The remainder of thephotoresist is removed, leaving behind a patterned layer. Alternatively,some types of materials are patterned by directly depositing thematerial into the areas or voids formed by a previous deposition/etchprocess using techniques such as electroless and electrolytic plating.

Depositing a thin film of material over an existing pattern canexaggerate the underlying pattern and create a non-uniformly flatsurface. A uniformly flat surface is required to produce smaller andmore densely packed active and passive components. Planarization can beused to remove material from the surface of the wafer and produce auniformly flat surface. Planarization involves polishing the surface ofthe wafer with a polishing pad. An abrasive material and corrosivechemical are added to the surface of the wafer during polishing. Thecombined mechanical action of the abrasive and corrosive action of thechemical removes any irregular topography, resulting in a uniformly flatsurface.

Back-end manufacturing refers to cutting or singulating the finishedwafer into the individual die and then packaging the die for structuralsupport and environmental isolation. To singulate the semiconductor die,the wafer is scored and broken along non-functional regions of the wafercalled saw streets or scribes. The wafer is singulated using a lasercutting tool or saw blade. After singulation, the individualsemiconductor die are mounted to a package substrate that includes pinsor contact pads for interconnection with other system components.Contact pads formed over the semiconductor die are then connected tocontact pads within the package. The electrical connections can be madewith solder bumps, stud bumps, conductive paste, or wirebonds. Anencapsulant or other molding material is deposited over the package toprovide physical support and electrical isolation. The finished packageis then inserted into an electrical system and the functionality of thesemiconductor device is made available to the other system components.

FIG. 1 illustrates electronic device 50 having a chip carrier substrateor printed circuit board (PCB) 52 with a plurality of semiconductorpackages mounted on its surface. Electronic device 50 can have one typeof semiconductor package, or multiple types of semiconductor packages,depending on the application. The different types of semiconductorpackages are shown in FIG. 1 for purposes of illustration.

Electronic device 50 can be a stand-alone system that uses thesemiconductor packages to perform one or more electrical functions.Alternatively, electronic device 50 can be a subcomponent of a largersystem. For example, electronic device 50 can be part of a cellularphone, personal digital assistant (PDA), digital video camera (DVC), orother electronic communication device. Alternatively, electronic device50 can be a graphics card, network interface card, or other signalprocessing card that can be inserted into a computer. The semiconductorpackage can include microprocessors, memories, application specificintegrated circuits (ASIC), logic circuits, analog circuits, RFcircuits, discrete devices, or other semiconductor die or electricalcomponents. Miniaturization and weight reduction are essential for theseproducts to be accepted by the market. The distance betweensemiconductor devices must be decreased to achieve higher density.

In FIG. 1, PCB 52 provides a general substrate for structural supportand electrical interconnect of the semiconductor packages mounted on thePCB. Conductive signal traces 54 are formed over a surface or withinlayers of PCB 52 using evaporation, electrolytic plating, electrolessplating, screen printing, or other suitable metal deposition process.Signal traces 54 provide for electrical communication between each ofthe semiconductor packages, mounted components, and other externalsystem components. Traces 54 also provide power and ground connectionsto each of the semiconductor packages.

In some embodiments, a semiconductor device has two packaging levels.First level packaging is a technique for mechanically and electricallyattaching the semiconductor die to an intermediate carrier. Second levelpackaging involves mechanically and electrically attaching theintermediate carrier to the PCB. In other embodiments, a semiconductordevice may only have the first level packaging where the die ismechanically and electrically mounted directly to the PCB.

For the purpose of illustration, several types of first level packaging,including bond wire package 56 and flipchip 58, are shown on PCB 52.Additionally, several types of second level packaging, including ballgrid array (BGA) 60, bump chip carrier (BCC) 62, dual in-line package(DIP) 64, land grid array (LGA) 66, multi-chip module (MCM) 68, quadflat non-leaded package (QFN) 70, and quad flat package 72, are shownmounted on PCB 52. Depending upon the system requirements, anycombination of semiconductor packages, configured with any combinationof first and second level packaging styles, as well as other electroniccomponents, can be connected to PCB 52. In some embodiments, electronicdevice 50 includes a single attached semiconductor package, while otherembodiments call for multiple interconnected packages. By combining oneor more semiconductor packages over a single substrate, manufacturerscan incorporate pre-made components into electronic devices and systems.Because the semiconductor packages include sophisticated functionality,electronic devices can be manufactured using cheaper components and astreamlined manufacturing process. The resulting devices are less likelyto fail and less expensive to manufacture resulting in a lower cost forconsumers.

FIGS. 2 a-2 c show exemplary semiconductor packages. FIG. 2 aillustrates further detail of DIP 64 mounted on PCB 52. Semiconductordie 74 includes an active region containing analog or digital circuitsimplemented as active devices, passive devices, conductive layers, anddielectric layers formed within the die and are electricallyinterconnected according to the electrical design of the die. Forexample, the circuit can include one or more transistors, diodes,inductors, capacitors, resistors, and other circuit elements formedwithin the active region of semiconductor die 74. Contact pads 76 areone or more layers of conductive material, such as aluminum (Al), copper(Cu), tin (Sn), nickel (Ni), gold (Au), or silver (Ag), and areelectrically connected to the circuit elements formed withinsemiconductor die 74. During assembly of DIP 64, semiconductor die 74 ismounted to an intermediate carrier 78 using a gold-silicon eutecticlayer or adhesive material such as thermal epoxy or epoxy resin. Thepackage body includes an insulative packaging material such as polymeror ceramic. Conductor leads 80 and bond wires 82 provide electricalinterconnect between semiconductor die 74 and PCB 52. Encapsulant 84 isdeposited over the package for environmental protection by preventingmoisture and particles from entering the package and contaminatingsemiconductor die 74 or bond wires 82.

FIG. 2 b illustrates further detail of BCC 62 mounted on PCB 52.Semiconductor die 88 is mounted over carrier 90 using an underfill orepoxy-resin adhesive material 92. Bond wires 94 provide first levelpackaging interconnect between contact pads 96 and 98. Molding compoundor encapsulant 100 is deposited over semiconductor die 88 and bond wires94 to provide physical support and electrical isolation for the device.Contact pads 102 are formed over a surface of PCB 52 using a suitablemetal deposition process such as electrolytic plating or electrolessplating to prevent oxidation. Contact pads 102 are electricallyconnected to one or more conductive signal traces 54 in PCB 52. Bumps104 are formed between contact pads 98 of BCC 62 and contact pads 102 ofPCB 52.

In FIG. 2 c, semiconductor die 58 is mounted face down to intermediatecarrier 106 with a flipchip style first level packaging. Active region108 of semiconductor die 58 contains analog or digital circuitsimplemented as active devices, passive devices, conductive layers, anddielectric layers formed according to the electrical design of the die.For example, the circuit can include one or more transistors, diodes,inductors, capacitors, resistors, and other circuit elements withinactive region 108. Semiconductor die 58 is electrically and mechanicallyconnected to carrier 106 through bumps 110.

BGA 60 is electrically and mechanically connected to PCB 52 with a BGAstyle second level packaging using bumps 112. Semiconductor die 58 iselectrically connected to conductive signal traces 54 in PCB 52 throughbumps 110, signal lines 114, and bumps 112. A molding compound orencapsulant 116 is deposited over semiconductor die 58 and carrier 106to provide physical support and electrical isolation for the device. Theflipchip semiconductor device provides a short electrical conductionpath from the active devices on semiconductor die 58 to conductiontracks on PCB 52 in order to reduce signal propagation distance, lowercapacitance, and improve overall circuit performance. In anotherembodiment, the semiconductor die 58 can be mechanically andelectrically connected directly to PCB 52 using flipchip style firstlevel packaging without intermediate carrier 106.

FIGS. 3 a-3 h illustrate, in relation to FIGS. 1 and 2 a-2 c, a processof forming an EMI and RFI shielding layer over an active surface andside surfaces of a semiconductor die. FIG. 3 a shows a semiconductorwafer 120 with a base substrate material 122, such as silicon,germanium, gallium arsenide, indium phosphide, or silicon carbide, forstructural support. A plurality of semiconductor die or components 124is formed on wafer 120 separated by a non-active, inter-die wafer areaor saw street 126 as described above. Saw street 126 provides cuttingareas to singulate semiconductor wafer 120 into individual semiconductordie 124. In one embodiment, semiconductor die 124 may have dimensionsranging from 2×2 millimeters (mm) to 15×15 mm.

FIG. 3 b shows a cross-sectional view of a portion of semiconductorwafer 120. Each semiconductor die 124 has a back surface 128 and activesurface 130 containing analog or digital circuits implemented as activedevices, passive devices, conductive layers, and dielectric layersformed within the die and electrically interconnected according to theelectrical design and function of the die. For example, the circuit mayinclude one or more transistors, diodes, and other circuit elementsformed within active surface 130 to implement analog circuits or digitalcircuits, such as digital signal processor (DSP), ASIC, memory, or othersignal processing circuit. Semiconductor die 124 may also containintegrated passive devices (IPD), such as inductors, capacitors, andresistors, for RF signal processing. Semiconductor die 124 can be aflipchip type die, wire-bonded die, or conductive through silicon via(TSV) die.

An electrically conductive layer 132 is formed over active surface 130using PVD, CVD, electrolytic plating, electroless plating process, orother suitable metal deposition process. Conductive layer 132 can be oneor more layers of Al, Cu, Sn, Ni, Au, Ag, or other suitable electricallyconductive material. Conductive layer 132 operates as contact padselectrically connected to the circuits on active surface 130. Contactpads 132 can be disposed side-by-side a first distance from the edge ofsemiconductor die 124, as shown in FIG. 3 b. Alternatively, contact pads132 can be offset in multiple rows such that a first row of contact padsis disposed a first distance from the edge of the die, and a second rowof contact pads alternating with the first row is disposed a seconddistance from the edge of the die.

In FIG. 3 c, an insulating or passivation layer 136 is formed overactive surface 130 while in wafer form using PVD, CVD, printing, spincoating, spray coating, sintering or thermal oxidation. The insulatinglayer 136 contains one or more layers of silicon dioxide (SiO2), siliconnitride (Si3N4), silicon oxynitride (SiON), tantalum pentoxide (Ta2O5),aluminum oxide (Al2O3), or other material having similar insulating andstructural properties. The blanket insulating layer 136 completelycovers active surface 130. A portion of insulating layer 136 is removedby an etching process to expose conductive layer 132 and saw street 126,as shown in FIG. 3 d.

In FIG. 3 e, a plurality of blind vias or openings 138 is formed intoactive surface 130 between conductive layer 132 using mechanicaldrilling, laser drilling, or deep reactive ion etching (DRIE). Eachsemiconductor die 124 can contain one or more blind vias 138. Inaddition or alternatively, a partial trench or opening 140 is formedalong saw street 126 around a perimeter of semiconductor die 124 usingmechanical drilling, laser drilling, or DRIE. Vias 138 and trench 140extend partially but not completely through semiconductor wafer 120. Inone embodiment, vias 138 and trench 140 are cut through 60% of thethickness of semiconductor wafer 120. The remaining portion ofsemiconductor wafer 120 between vias 138 and trench 140 and back surface128 provide structural support for the wafer during subsequentmanufacturing processes.

In FIG. 3 f, an insulating or passivation layer 142 is conformallyapplied into blind vias 138 and partial trench 140 using PVD, CVD,printing, spin coating, spray coating, sintering or thermal oxidation.The insulating layer 142 contains one or more layers of SiO2, Si3N4,SiON, Ta2O5, Al2O3, or other material having similar insulating andstructural properties. The insulating layer 142 follows the contour ofvias 138 and trench 140 and may also cover insulating layer 136.

Semiconductor die 124 may contain baseband circuits that generate EMI,RFI, or other inter-device interference, such as capacitive, inductive,or conductive coupling. In other embodiments, semiconductor die 124contain IPDs that are susceptible to EMI, RFI, and inter-deviceinterference. For example, the IPDs contained within semiconductor die124 provide the electrical characteristics needed for high frequencyapplications, such as resonators, high-pass filters, low-pass filters,band-pass filters, symmetric Hi-Q resonant transformers, and tuningcapacitors. The IPDs can be used as front-end wireless RF components,which can be positioned between the antenna and transceiver. The IPDinductor can be a hi-Q balun, transformer, or coil, operating up to 100Gigahertz. In some applications, multiple baluns are formed on a samesubstrate, allowing multi-band operation. For example, two or morebaluns are used in a quad-band for mobile phones or other global systemfor mobile (GSM) communications, each balun is dedicated for a frequencyband of operation of the quad-band device. A typical RF system requiresmultiple IPDs and other high frequency circuits in one or moresemiconductor packages to perform the necessary electrical functions.

In FIG. 3 g, an electrically conductive layer 144 is conformallydeposited over insulating layers 136 and 142 covering active surface 130while in wafer form using a patterning and metal deposition process suchas electrolytic plating, and electroless plating, sputtering, PVD, CVD,or other suitable metal deposition process. In one embodiment,conductive layer 144 is substantially flat with a thickness of 5-25micrometers (μm) and follows the contour of insulating layers 136 and142 over active surface 130 and into vias 138 and trench 140. Conductivelayer 144 is patterned so as to not cover conductive layer 132, i.e., toleave the contact pads of semiconductor die 124 exposed. The portion ofconductive layer 144 over active surface 130 operates as a shieldinglayer 145 to reduce the effects of EMI and RFI. Conductive layer 144 canbe one or more layers of Al, Cu, Sn, Ni, Au, Ag, or other suitableelectrically conductive material. Shielding layer 145 over activesurface 130 can also be ferrite or carbonyl iron, stainless steel,nickel silver, low-carbon steel, silicon-iron steel, foil, conductiveresin, conductive paste, and other metals and composites capable ofblocking or absorbing EMI, RFI, and other inter-device interference.Shielding layer 145 is electrically isolated from the circuits on activesurface 130 by insulating layers 136 and 142.

In another embodiment, the portion of shielding layer 145 over activesurface 130 can also be a non-metal material such as carbon-black oraluminum flake to reduce the effects of EMI and RFI. For non-metalmaterials, shielding layer 145 can be applied by lamination, spraying,or painting.

The deposition of conductive layer 144 extends into vias 138 and trench140 to cover the sidewalls of the vias and trench and form z-directionblind conductive through silicon vias (TSV) 146. Alternatively,conductive layer 144 completely fills vias 138 and trench 140 to formthe z-direction blind conductive TSV 146. The portion of conductivelayer 144 in trenches 140 operates as a shielding layer to reduce theeffects of EMI and RFI with respect to the side surfaces ofsemiconductor die 124. Accordingly, the shielding layer covers a topportion and side portion of each semiconductor die 124 while in the formof semiconductor wafer 120.

In FIG. 3 h, semiconductor wafer 120 is inverted and mounted with activesurface 130 oriented to carrier or backgrinding tape 148. A portion ofback surface 128 of semiconductor wafer 120 is removed by grinder 150 toexpose conductive TSV 146 and singulate the wafer into separatesemiconductor die 124. The individual semiconductor devices 152,including semiconductor die 124 and overlying shielding layer 145, areremoved from carrier 148.

FIGS. 4 a-4 b show a cross-section view and top view of semiconductordevice 152 after singulation. The flat shielding layer 145 is readilyformed over active surface 130 of semiconductor die 124 to block orabsorb EMI, RFI, and other inter-device interference. The wafer-levelshielding layer 145 provides high productivity in terms of manufacturingunits per hour (UPH) at lower production cost for semiconductor device152. The flat shielding layer 145 also reduces height of semiconductordevice 152. Shielding layer 145 provides EMI coverage over activesurface 130 and around the edges and sides of semiconductor die 124 androutes EMI, RFI, and other interfering signals through conductive TSV146 an external low-impedance ground point. Accordingly, the flatshielding layer 145 provides effective EMI and RFI shielding for activesurface 130, as well as the edges and side surfaces of semiconductor die124.

FIG. 5 shows semiconductor device 152 mounted to substrate or PCB 154with die attach adhesive or conductive adhesive 156, such as epoxy resinor conductive paste. Bond wires 160 are formed between contact pads 132of semiconductor die 124 and conductive traces 162 formed withinsubstrate 154 for power supply connections and signal transmissionbetween the die and substrate. As a first option in grounding shieldinglayer 145, bond wire 164 is formed between a top surface of theshielding layer and conductive trace 166 within substrate 154 to providean external low-impedance ground point. As a second option in groundingshielding layer 145, conductive TSV 146 can be electrically connected toconductive trace 168 of substrate 154 with bump 170 to provide anexternal low-impedance ground point. As a third option in groundingshielding layer 145, conductive TSV 146 can be electrically connectedthrough conductive adhesive 156 deposited between semiconductor die 124and substrate 154 to conductive trace 172, which provides an externallow-impedance ground point. Conductive adhesive 156 also provides EMIand RFI shielding for the back surface of semiconductor die 124.

While one or more embodiments of the present invention have beenillustrated in detail, the skilled artisan will appreciate thatmodifications and adaptations to those embodiments may be made withoutdeparting from the scope of the present invention as set forth in thefollowing claims.

What is claimed:
 1. A method of making a semiconductor device,comprising: providing a semiconductor wafer including a plurality ofsemiconductor die; forming a plurality of contact pads on an activesurface of the semiconductor die; forming a first insulating layer overthe semiconductor wafer; removing a portion of the first insulatinglayer to expose the contact pads on the semiconductor die; forming anopening partially through the semiconductor wafer; forming a secondinsulating layer in the opening in the semiconductor wafer; forming ashielding layer over the active surface with the shielding layerextending into the opening of the semiconductor wafer to form aconductive via; and removing a portion of a back surface of thesemiconductor wafer to singulate the semiconductor die.
 2. The method ofclaim 1, further including electrically connecting the shielding layerthrough the conductive via to a ground point.
 3. The method of claim 1,further including forming a bond wire between a surface of the shieldinglayer and a ground point.
 4. The method of claim 1, further including:providing a substrate; and disposing the semiconductor die over thesubstrate including a conductive adhesive with the shielding layer beingelectrically connected through the conductive adhesive to a groundpoint.
 5. The method of claim 1, further including: providing asubstrate; disposing the semiconductor die over the substrate includinga die attach adhesive; and forming a bump between the conductive via anda ground point to ground the shielding layer.
 6. The method of claim 1,further including conformally applying the second insulating layer tosidewalls of the opening in the semiconductor wafer.
 7. A method ofmaking a semiconductor device, comprising: providing a semiconductorwafer including a plurality of semiconductor die; forming a firstinsulating layer over the semiconductor wafer; forming an openingpartially through the semiconductor wafer; forming a second insulatinglayer in the opening in the semiconductor wafer; forming a shieldinglayer covering an active surface and side surfaces of the semiconductordie with the shielding layer extending into the opening of thesemiconductor wafer to form a conductive via; and removing a portion ofa back surface of the semiconductor wafer to singulate the semiconductordie.
 8. The method of claim 7, further including forming the openingpartially through the semiconductor wafer.
 9. The method of claim 7,further including removing a portion of the first insulating layer toexpose contact pads on the semiconductor die.
 10. The method of claim 7,further including electrically connecting the shielding layer throughthe conductive via to a ground point.
 11. The method of claim 7, furtherincluding forming a bond wire between a surface of the shielding layerand a ground point.
 12. The method of claim 7, further including:providing a substrate; and disposing the semiconductor die over thesubstrate including a conductive adhesive electrically connecting theshielding layer and a ground point.
 13. The method of claim 7, furtherincluding: providing a substrate; disposing the semiconductor die overthe substrate including a die attach adhesive; and forming a bumpbetween the conductive via and a ground point to ground the shieldinglayer.
 14. A method of making a semiconductor device, comprising:providing a semiconductor die including a contact pad on a first surfaceof the semiconductor die; forming a first insulating layer over thesemiconductor die; forming an opening through the semiconductor die; andforming a shielding layer over the first surface of the semiconductordie and a second surface of the semiconductor die adjacent to the firstsurface leaving the contact pad exposed, the shielding layer extendinginto the opening of the semiconductor die to form a conductive via. 15.The method of claim 14, further including forming a second insulatinglayer in the opening in the semiconductor die.
 16. The method of claim14, further including removing a portion of the first insulating layerto expose contact pads on the semiconductor die.
 17. The method of claim14, further including electrically connecting the shielding layerthrough the conductive via to a ground point.
 18. The method of claim14, further including forming a bond wire between a surface of theshielding layer and a ground point.
 19. The method of claim 14, furtherincluding: providing a substrate; and disposing the semiconductor dieover the substrate including a conductive adhesive electricallyconnecting the shielding layer and a ground point.
 20. The method ofclaim 14, further including: providing a substrate; and disposing thesemiconductor die over the substrate including a die attach adhesive;and forming a bump between the conductive via and a ground point toground the shielding layer.
 21. A semiconductor device, comprising: asemiconductor wafer including a plurality of semiconductor die; a firstinsulating layer formed over the semiconductor wafer; an opening formedthrough the semiconductor wafer; a second insulating layer formed in theopening; and a shielding layer formed to completely cover an activesurface of the semiconductor die and extending into the opening of thesemiconductor wafer to form a conductive via.
 22. The semiconductordevice of claim 21, wherein a portion of a back surface of thesemiconductor wafer is removed to singulate the semiconductor die. 23.The semiconductor device of claim 21, wherein the shielding layer iselectrically connected through the conductive via to a ground point. 24.The semiconductor device of claim 21, further including a bond wireformed between a surface of the shielding layer and a ground point. 25.The semiconductor device of claim 21, further including a substratecomprising a ground point with the semiconductor die disposed over thesubstrate and electrically connected to the ground point.